Manufacturers OEM

Micro Systems Technologies Management AG

Neuhofstr. 4 , 6340 Baar
Switzerland

Telephone +41 44 8046300
Fax +41 44 8046301
info@mst.com

Trade fair hall

  • Hall 8a / C03
 Interactive Plan

Hall map

COMPAMED 2016 hall map (Hall 8a): stand C03

Fairground map

COMPAMED 2016 fairground map: Hall 8a

Our range of products

Product categories

  • 02  Electrical and electronic components
  • 02.02  Batteries
  • 02  Electrical and electronic components
  • 02.27  Printed circuit boards

Printed circuit boards

  • 02  Electrical and electronic components
  • 02.39  Connectors

Connectors

  • 11  Manufacturing Services
  • 11.12  Electronic systems / subassemblies
  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.05  Encapsulation

Encapsulation

  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.13  Assembly

Assembly

  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.14  High end assembly

High end assembly

  • 13  Services
  • 13.01  Design, Research and Development Services
  • 13.01.13  Microtechnology

Microtechnology

Our products

Product category: Batteries

Battery technology

Lithium-Iodine technology and the Lithium-Manganese Dioxide technology are the base for our standard product lines and are available for customized battery solutions.

Our standard product lines cover three ranges of performance for different applications:

High Energy Batteries

- typical application: implantable pulse generators such as pacemakers
- Lithium-Iodine technology
- highest volumetric energy densities
- lowest self-discharge rates
- long operational safety

Medium Rate Batteries

- typical application: implantable devices with medium pulse power demands such as pacemakers with telemetric functions
- Lithium Manganese Dioxide technology
- very high power densities
- low self-discharge rates
- no voltage delays

High Power Batteries
- typical application: implantable defibrillators and other devices with high pulse power demands
- Lithium Manganese Dioxide technology
- very high power densities
- fastest capacitor charging
- low self-discharge rates
- no voltage delays
- Our core areas of expertise for developing and manufacturing customized solutions include:
- electrochemistry
- materials science
- chemical and physical analysis such as ICP-OES (inductively coupled plasma optical emission spectrometry), IR spectroscopy, gas chromatography, laser diffraction spectroscopy, Karl-Fischer analysis, BET surface determination and microcalorimetry
- powder processing including milling, separation, drying and heat treatment
- production in specialized dry conditions
- metal and plastics engineering
- laser and plasma welding
- chemical synthesis of cathode material
- electrical characterization of the end product

For further information or to ask us to help you work out a specific solution, please get in touch with us.

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Product category: Electronic systems / subassemblies

Feedthrough technology

MST offers the development and manufacture of customer-specific feedthroughs for implants or sub-assemblies requiring hermetically sealed interfaces.

Three base technologies are available for countless solutions.

Ceramic-to-metal feedthroughs

- typical application: medtech implants such as pacemakers, defibrillators or neurostimulators
- material compositions: Ti/Al2O3/Nb or Ti/Al2O3/PtIr
- geometry: circular or linear
- unipolar to multipolar pin configurations
- contacting through welding or soldering

Glass-to-metal feedthroughs
- typical application: batteries for implants
- material compositions: 304L/FeNi52 or 304L/Mo
- unipolar to multipolar pin configurations
- contacting through welding or soldering

Hybrids: glass/ceramic-to-metal feedthroughs
- typical application: sensors or high-vacuum components
- customized material compositions
- unipolar to multipolar pin configurations
- contacting through welding or soldering

The core areas of expertise for developing and manufacturing hermetic feedthroughs include:
- materials science
- design and process engineering
- wet chemical conditioning
- high-vacuum metallization (sputtering)
- high-temperature/high-vacuum soldering of glass
- high-temperature soldering using gold
- resistance welding
- micro sandblasting
- assembly
- mechanical and physical testing of components and materials
- hermeticity testing
- visual inspection

For further information or to ask us to help you work out a specific solution, please get in touch with us.

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Product category: Electronic systems / subassemblies

Interconnect technology & electronic manufacturing services (EMS)

The MST Group has extensive experience in designing and manufacturing complex, miniaturized electronic modules for medical devices and other high-reliability applications.

Our core areas of expertise for manufacturing an electronic module include:

Advanced assembly technologies
- automated SMD assembly
- flip chip and chip scale packages
wire bonding technologies
- ultrasonic bonding
- thermosonic wedge/wedge bonding
- thermosonic ball/wedge bonding
die attach technologies
- gluing
- soldering
- AuSi eutectic bonding
- die protection and encapsulation

Printed circuit boards and chip packaging substrates

- highly complex HDI/microvia substrates in flex. rigid-flex and rigid technology
- high-frequency and high-temperature applications
- microfluidic substrates
- comprehensive range of base materials, constraining materials and surface finishes
- enhanced features such as embedded passives, wrap-around, cavities
- chip-on-flex (COF) and chip scale packaging (CSP) substrates
- LCP (Liquid Crystal Polymer) substrates

LTCC (low temperature co-fired ceramic) substrates

- stacking of 2 layers up to more than 20 layers
- embedding of passive components such as capacitors, inductors and resistors
- mounting of frames, metal plates or pins by soldering
- mechanical processing by laser cutting or machining

Test services
The MST group has a wide range of test technologies available to demonstrate the required performance of components, sub-assemblies or modules.

For further information or to ask us to help you work out a specific solution, please get in touch with us.

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About us

Company details

The Micro Systems Technologies Group offers comprehensive solutions for the medical device industry - especially for active implants. The globally active MST group comprises four technology companies with more than 1000 employees:

- DYCONEX AG (Bassersdorf, Switzerland):
Highly complex HDI, high-frequency and high-reliability PCBs in flex, rigid-flex and rigid technology.

- LITRONIK Batterietechnologie GmbH (Pirna, Germany):
High-performance batteries, battery packs and hermetic feedthroughs for active implants.

- Micro Systems Engineering GmbH (Berg, Germany):
Manufacturing of multilayer ceramic substrates based on LTCC (Low Temperature Co-fired Ceramic) and thick film, advanced assembly in the field of SMT and chip & wire, as well as semiconductor packaging processes including production of stacked die BGAs using transfer molding.

- Micro Systems Engineering, Inc. (Lake Oswego, OR, USA):
Design and manufacturing of electronic modules for class III devices including SMD board assembly services.

The development and manufacture of components and modules for life-sustaining medical devices and other critical applications characterize the quality awareness and the management systems of all MST companies. During manufacturing, MST companies guarantee complete traceability of materials and processes.

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