AT&S Austria Technologie & Systemtechnik AG

Fabriksgasse 13 , 8700 Leoben
Austria

Telephone +43 3842 200-0
Fax +43 3842 200-216
info@ats.net

This company is co-exhibitor of
ADVANTAGE AUSTRIA Wirtschaftskammer Österreich

Trade fair hall

  • Hall 8b / F04
 Interactive Plan

Hall map

COMPAMED 2016 hall map (Hall 8b): stand F04

Fairground map

COMPAMED 2016 fairground map: Hall 8b

Our range of products

Product categories

  • 02  Electrical and electronic components
  • 02.26  Application specific integrated circuits

Application specific integrated circuits

  • 02  Electrical and electronic components
  • 02.27  Printed circuit boards
  • 02  Electrical and electronic components
  • 02.29  Sensors

Our products

Product category: Application specific integrated circuits

IMS Insulated Metallic Substrate PCBs

In the single side printed circuit board business, AT&S focuses on IMS boards. These are used primarily as heat sinks for LEDs and power components. To enable heat dissipation, the base material used has one side that is an aluminium or copper layer either 1.0mm or 1.6mm thick.

AT&S offers the following special features:

Materials with prepreg or thermally conductive resins
Thermal conductivity in the 0.35-8.0 W/(m•K) range
Scored or routed versions
White or black solder resist
Based on highly reflective aluminium e.g. Alanod®
Special surfaces are possible, such as ceramic surfaces

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Product category: Printed circuit boards

Double Sided PTH PCBs

Double-sided plated-through printed circuit boards are in use throughout the electronics sector, and more particularly in industrial and automotive applications. AT&S specialises in series production of double-sided printed circuit boards with thicknesses in the 0.1-3.2mm range.

AT&S offers double-sided plated-through printed circuit boards with the following special features:

Edge plating for shielding and ground connection
Metal core for high thermal conductivity (metal, copper or aluminium)
Copper inlay for hotspot cooling
Solder resist in green, white, black, blue, grey, brown, etc.
Copper thickness of over 140μm
All surfaces which are commonly used in the printed circuit board industry

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Product category: Printed circuit boards

HDI Microvia PCBs

The history of AT&S has been shaped by high density interconnect (HDI) printed circuit boards. In 1997 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications throughout the electronics industry, and their use was given additional impetus by the introduction of BGA/CSP components. AT&S offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.

Special technologies offered by AT&S in connection with HDI:

Edge plating for shielding and ground connection
Copper-filled microvias
Stacked and staggered microvias
Cavities, countersunk holes or depth milling
Solder resist in black, blue, green, etc.
Minimum track width and spacing in mass production around 50μm
Low-halogen material in standard and high Tg range
Low-DK Material for Mobile Devices
All recognised printed circuit board industry surfaces available

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Product category: Printed circuit boards

HDI Any-Layer PCBs

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, AT&S uses laser-drilled microvias electroplated with copper.

Special technologies used with HDI any-layer printed circuit boards:

Edge plating for shielding and ground connection
Minimum track width and spacing in mass production around 40μm
Stacked microvias (plated copper or filled with conductive paste)
Cavities, countersunk holes or depth milling
Solder resist in black, blue, green, etc.
Low-halogen material in standard and high Tg range
Low-DK Material for Mobile Devices
All recognised printed circuit board industry surfaces available

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Product category: Printed circuit boards

Flexible & Rigid Flexible PCBs

 

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Product category: Sensors

IC Substrates

Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer level smartphones, tablets and PCs to high performance graphics workstations, servers and IT infrastructure equipment.

AT&S provides IC substrates for Flip Chip packaging in a variety of single and multi-chip, BGA and LGA form factors for high I/O, high performance applications, with micro bumps for C4 or TCB die attach. Substrates may have surface mounted passive devices on one or both sides and   delivered as array strips or singulated fabs in JEDEC trays.

Our advanced build-up process, highly automated, contact-free and totally contained in cleanrooms, starts with formation of a reinforced core board with filled core or copper filled buried vias that provide a platform to build-up multiple layers of unreinforced dielectric film alternating with copper circuits formed by a Semi Additive Process (SAP).

This versatile system provides the best balance of performance, reliability and value for the high-density interconnect products leading the industry.

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About us

Company details

AT&S is currently Europe’s largest printed circuit board manufacturer and one of the market leaders in high-end printed circuit board technology. Depending on technological and economic requirements, AT&S offers the widest possible range of printed circuit boards specially tailored to customers’ needs: double-sided plated-through, multi-layer, HDI (high density interconnection, laser-drilled), IMS (insulated metallic substrate), flexible, rigid-flex and semi-flexible.The core businesses of AT&S are Mobile Devices, Automotive, Industrial, Medical, Aviation and Advanced Packaging.

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Company data

Sales volume

> 500 Mio US $

Export content

> 75%

Number of employees

> 5000

Foundation

1987