3D Interconnection technology for future wearable bioelectronics -- COMPAMED Trade Fair

3D Interconnection technology for future wearable bioelectronics

22.08.2019

Image: Curvy wires; Copyright: IBS

Schematic illustrations (left) and scanning-electron microscopic images (right) of various 3D structures of printed stretchable metal composites. 3D interconnection can overlap Scale bars are 100 μm.

Products and exhibitors around electronics

Image: Finger wearing an oxygen sensor; Copyright: Messe Düsseldorf