3D Interconnection technology for future wearable bioelectronics -- COMPAMED Trade Fair
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3D Interconnection technology for future wearable bioelectronics

22.08.2019

Image: Curvy wires; Copyright: IBS

Schematic illustrations (left) and scanning-electron microscopic images (right) of various 3D structures of printed stretchable metal composites. 3D interconnection can overlap Scale bars are 100 μm.

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Image: Finger wearing an oxygen sensor; Copyright: Messe Düsseldorf

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