Hydrogel semiconductor bridges bioelectronics and living tissue -- COMPAMED Trade Fair

27.11.2024

Researchers at the University of Chicago’s Pritzker School of Molecular Engineering have developed a unique hydrogel semiconductor with properties ideal for medical applications. This new material offers seamless integration with tissue, paving the way for advanced bioelectronic devices in implants and non-surgical applications.

Image: Semiconductor hydrogel placed into a vessel with tweezers hold in gloved hands; Copyright: UChicago Pritzker School of Molecular Engineering / John Zich

Researchers at UChicago's Pritzker School of Molecular Engineering, led by Asst. Prof. Sihong Wang, have created a semiconductive hydrogel for transmitting signals between living tissue and machines. This innovation supports use in implantable medical devices and non-surgical applications.

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Under the direction of Asst. Prof. Sihong Wang, the team has developed the hydrogel semiconductor, which unlike traditional rigid semiconductors, boasts both elasticity and hydration similar to human tissue, making it a prime candidate for use in biomedical implants such as pacemakers, biosensors, and wound care applications.

New material design for superior tissue compatibility

Traditional hydrogels excel in biomedical uses due to their softness, stretchability, and water-loving nature. However, semiconductors – essential for bioelectronics – are typically stiff, brittle, and lack hydrophilicity, making integration with living tissues challenging. To overcome this, the UChicago team developed a new manufacturing method for their hydrogel that allows it to retain semiconductive properties while remaining soft and compatible with biological tissues. The result is a material with tissue-like elasticity, excellent conductivity, and high hydration levels, all critical features for medical implants and biointerfaces.

Innovative approach to hydrogel fabrication

Standard hydrogels are typically produced by dissolving materials in water, but semiconductors do not dissolve easily in aqueous solutions. As an alternative, the research team employed a solvent-exchange technique, initially dissolving semiconductors in an organic solvent compatible with water. The initial result was an organogel, which was then transitioned to a hydrogel through immersion in water, creating a seamless semiconductor-hydrogel hybrid.

Advantages in bioelectronics and medical devices

This new hydrogel semiconductor, which UChicago PME is commercializing through the Polsky Center, opens promising avenues in bioelectronic applications. Not only does the material’s softness reduce immune response and inflammation associated with medical implants, but its porosity enhances the diffusion of biomolecules, allowing for improved sensitivity in biosensing and therapeutic applications.

The unique design enables light-driven functions such as photomodulation in pacemakers and wound dressings, promoting faster healing processes. The combination of semiconductor properties with hydrogel form opens new possibilities in bioelectronics, from brain-machine interfaces to advanced wound care.

COMPAMED-tradefair.com; Source: University of Chicago

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