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Image: The image shows multiple MRI brain scans

MRI reveals early signs of frontotemporal dementia

04.11.2025

A new MRI technique detects microstructural brain changes before symptoms of frontotemporal dementia appear.
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Graphic with three central components of medical electronics shown in rings

Medical electronics: technology behind it

12.06.2025

Three essential functions make up medical electronics - from data acquisition to data intelligence.
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Image: Close-up of piezoceramic stack actuator on blue background; Copyright: Fraunhofer IKTS

Fraunhofer IKTS

COMPAMED 2023: Piezoceramics for root canal treatment

08.11.2023

A new piezoceramic actuator adds vibration to root canal files, reducing jamming and improving efficiency during tissue removal.
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Image: A patient is wheeled into a CT scanner. The patient smiles; Copyright: AZ-BLT

AZ-BLT

New imaging technology for a quick look inside a human being

03.08.2023

Physicists at the University of Würzburg have developed a new imaging method for humans that works without radiation or radioactive markers.
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Image: A person works on a machine; Copyright: ThisisEngineering RAEng / Unsplash

ThisisEngineering RAEng / Unsplash

Sensors: when the ­machine reports its status

01.08.2023

In Industry 4.0, networking is key - but optimizing individual machines remains crucial, as interfaces start at the machine level.
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Image: Microelectronics assembly industrial factory - interior and group of workers; Copyright: astakhovyaroslav

astakhovyaroslav

SEMECO revolutionizes the medical electronics industry

18.05.2023

The project partners in the BMBF's SEMECO future cluster are convinced that the future of medical technology lies in the combination of digital innovation, safety and improved approval processes.
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Image: Four people pose next to a technical apparatus,Dr. Philip Wollmann, Dr. Wulf Grählert, Oliver Throl and Livia Szathmáry (from left); Copyright: Amac Garbe/Fraunhofer IWS

Amac Garbe/Fraunhofer IWS

Sharp hyperspectral eye for chip production

23.03.2023

Precise two-dimensional analysis of high-tech layers in microelectronics, battery factories or even in the automotive sector approaches within reach. A measuring system developed at the Fraunhofer Institute for Material and Beam Technology IWS.
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