The core expertise of the MST Group within the semiconductor industry lies in the area of semiconductor packaging.Semiconductor packaging
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.
The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.Base materials
- Ball Grid Array (BGA)
- Stacked Die BGA (SDBGA)
- High Voltage BGA
- Land Grid Array (LGA)
- Single In-Line / Dual In-Line (SIL/DIL)
- Quad Flat Packages (QFP)
- Non-hermetic housings using plastic/metal covers or organic coatings
- Hermetic housings by soldering
For further information or to ask us to help you work out a specific solution, please get in touch with us.