Micro Systems Technologies Management AG of Baar at COMPAMED 2017 in Düsseldorf -- COMPAMED Trade Fair
Manufacturers OEM

Micro Systems Technologies Management AG

Neuhofstr. 4, 6340 Baar
Switzerland

Telephone +41 44 8046300
info@mst.com

Hall map

COMPAMED 2017 hall map (Hall 8a): stand C03

Fairground map

COMPAMED 2017 fairground map: Hall 8a

Our range of products

Product categories

  • 02  Electrical and electronic components
  • 02.02  Batteries
  • 02  Electrical and electronic components
  • 02.27  Printed circuit boards
  • 02  Electrical and electronic components
  • 02.39  Connectors

Connectors

  • 11  Manufacturing Services
  • 11.12  Electronic systems / subassemblies
  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.05  Encapsulation

Encapsulation

  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.13  Assembly

Assembly

  • 11  Manufacturing Services
  • 11.16  Forming
  • 11.16.14  High end assembly

High end assembly

  • 13  Services
  • 13.01  Design, Research and Development Services
  • 13.01.13  Microtechnology

Our products

Product category: Batteries

Battery technology

Lithium-Iodine technology and the Lithium-Manganese Dioxide technology are the base for our standard product lines and are available for customized battery solutions.

Our standard product lines cover three ranges of performance for different applications:

High Energy Batteries
  • typical application: implantable pulse generators such as pacemakers
  • Lithium-Iodine technology
  • highest volumetric energy densities
  • lowest self-discharge rates
  • long operational safety

Medium Rate Batteries
  • typical application: implantable devices with medium pulse power demands such as pacemakers with telemetric functions
  • Lithium Manganese Dioxide technology
  • very high power densities
  • low self-discharge rates
  • no voltage delays

High Power Batteries
  • typical application: implantable defibrillators and other devices with high pulse power demands
  • Lithium Manganese Dioxide technology
  • very high power densities
  • fastest capacitor charging
  • low self-discharge rates
  • no voltage delays
Our core areas of expertise for developing and manufacturing customized solutions include:

  • electrochemistry
  • materials science
  • chemical and physical analysis such as ICP-OES (inductively coupled plasma optical emission spectrometry), IR spectroscopy, gas chromatography, laser diffraction spectroscopy, Karl-Fischer analysis, BET surface determination and microcalorimetry
  • powder processing including milling, separation, drying and heat treatment
  • production in specialized dry conditions
  • metal and plastics engineering
  • laser and plasma welding
  • chemical synthesis of cathode material
  • electrical characterization of the end product
For further information or to ask us to help you work out a specific solution, please get in touch with us.

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Product category: Printed circuit boards, Electronic systems / subassemblies, Microtechnology

Interconnect technology & electronic manufacturing services (EMS)

The MST Group has extensive experience in designing and manufacturing complex, miniaturized electronic modules for medical devices and other high-reliability applications.

Our core areas of expertise for manufacturing an electronic module include:

Advanced assembly technologies

  • automated SMD assembly
  • flip chip and chip scale packages
  • wire bonding technologies
    - ultrasonic bonding
    - thermosonic wedge/wedge bonding
    - thermosonic ball/wedge bonding
  • die attach technologies
    - gluing
    - soldering
    - AuSi eutectic bonding
  • die protection and encapsulation

Printed circuit boards and chip packaging substrates

  • highly complex HDI/microvia substrates in flex. rigid-flex and rigid technology
  • high-frequency and high-temperature applications
  • microfluidic substrates
  • comprehensive range of base materials, constraining materials and surface finishes
  • enhanced features such as embedded passives, wrap-around, cavities
  • chip-on-flex (COF) and chip scale packaging (CSP) substrates
  • LCP (Liquid Crystal Polymer) substrates

LTCC (low temperature co-fired ceramic) substrates

  • stacking of 2 layers up to more than 20 layers
  • embedding of passive components such as capacitors, inductors and resistors
  • mounting of frames, metal plates or pins by soldering
  • mechanical processing by laser cutting or machining

Test services
The MST group has a wide range of test technologies available to demonstrate the required performance of components, sub-assemblies or modules.

For further information or to ask us to help you work out a specific solution, please get in touch with us.

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Product category: Printed circuit boards, Electronic systems / subassemblies, Microtechnology

Semiconductor technology

The core expertise of the MST Group within the semiconductor industry lies in the area of semiconductor packaging.

Semiconductor packaging
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.

Base materials

  • LTCC
  • Al2O3
  • PCB

I/O configurations

  • Ball Grid Array (BGA)
    - Stacked Die BGA (SDBGA)
    - High Voltage BGA
  • Land Grid Array (LGA)
  • Castellation
  • Single In-Line / Dual In-Line (SIL/DIL)
  • Quad Flat Packages (QFP)

Housings

  • Non-hermetic housings using plastic/metal covers or organic coatings
  • Hermetic housings by soldering
For further information or to ask us to help you work out a specific solution, please get in touch with us.

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About us

Company details

Micro Systems Technologies Group - engineering for life
The Micro Systems Technologies (MST) Group applies its innovative products and services for the sole purpose of improving people’s lives. Its comprehensive offerings are targeted first and foremost at the requirements of medical technology, in particular for active implants, which represent a special application area for MST products. In addition, other high-tech industries that demand exceptional performance and the highest level of reliability rely on the expertise of MST companies. Examples include aerospace, telecommunications as well as challenging applications in the areas of sensors and actuators.

Active around the globe, the MST Group consists of four technology companies with more than 1100 employees in three countries, all of whom offer their customers integrated solutions that range from conceptual design through series production.

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